原文传递 Enhancing Mobility: The I-70/I-71 South Interbelt Corridor. Columbus, Ohio ACTT Workshop. Held in Columbus, Ohio on January 9-11, 2007.
题名: Enhancing Mobility: The I-70/I-71 South Interbelt Corridor. Columbus, Ohio ACTT Workshop. Held in Columbus, Ohio on January 9-11, 2007.
关键词: workshops, technology transfer, project management, contract administration, freeways
摘要: The Columbus Crossroads I-70/I-71 South Innerbelt Corridor Study ACTT workshop took place January 9-11, 2007, at the Marriott North Columbus Hotel in Columbus, Ohio. The ODOT workshop followed the traditional ACTT process. On Wednesday morning, the ACTT management team discussed the brainstorming process with workshop attendees. The skill sets then broke apart to discuss the project and brainstorm preliminary ideas, reconvening before lunch to share initial thoughts. Discussions continued during lunch, with attendees sharing some of their brainstorming ideas and other issues regarding the project. After lunch, the skill sets continued their work, intermingling with other teams to ask questions and share ideas. (The synergy created during these discussions is the heart of the process.) The teams spent the remainder of the afternoon preparing final recommendations for presentation to the group on Thursday morning. The I-70/I-71 South Innerbelt Corridor in downtown Columbus, known locally as the downtown split, is one of the busiest and most vital sections of highway in the region. Built in the 1960s, the highway lacks the capacity to serve the 150,000 vehicles and 17,000 trucks that traverse it daily. While the project corridor makes up only six percent of the freeway system, it is the site of 27 percent of all I-70/I-71 freeway accidents occurring in Franklin County. / Availability Note: Product reproduced from digital image. Order this product from NTIS by: phone at 1-800-553-NTIS (U.S. customers); (703)605-6000 (other countries); fax at (703)605-6900; and email at orders@ntis.gov. NTIS is located at 5285 Port Royal Road, Springfield, VA, 22161, USA.
总页数: u0722;60p
报告类型: 科技报告
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