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原文传递 Review of Sewer Design Criteria and RDII Prediction Methods.

题名：	Review of Sewer Design Criteria and RDII Prediction Methods.
作者：	lai, f. d.
关键词：	design criteria, infiltration, waste water, water treatment, microorganisms, toxicity, discharge(water), water pollution, health risks, environmental impacts, organic compounds, us epa
摘要：	Rainfall-derived Infiltration and Inflow (RDII) into sanitary sewer systems has long been recognized as a source of operating problems in sewerage systems. RDII is the main cause of sanitary sewer overflows (SSOs) to basements, streets, or nearby streams and can also cause serious operating problems at wastewater treatment facilities. SSOs usually contain high levels of pathogenic microorganisms, suspended solids, toxic pollutants, floatables, nutrients, oxygen-demanding organic components, and oil and grease. There are serious concerns of potential health and environmental risks associated with these discharges. The Nation's sanitary sewer infrastructure is aging, with some sewers dating back over 100 years. Nationwide, there are more than 19,500 municipal sanitary sewer collection systems serving an estimated 150 million people and about 40,000 SSO events per year. To assist municipalities in developing plans to mitigate SSO problems, the U.S. Environmental Protection Agency (EPA) in 2002 signed a cooperative research and development agreement (CRADA) with Camp Dresser & McKee Inc. (CDM) to develop a public-domain Sanitary Sewer Overflow Analysis and Planning (SSOAP) Toolbox. It contains a suite of computer software tools to facilitate the analysis of RDII and performance of sanitary sewer systems. / Supplementary Notes: Sponsored by National Risk Management Research Lab., Edison, NJ. Water Supply and Water Resources Div. / Availability Note: Product reproduced from digital image. Order this product from NTIS by: phone at 1-800-553-NTIS (U.S. customers); (703)605-6000 (other countries); fax at (703)605-6900; and email at orders@ntis.gov. NTIS is located at 5285 Port Royal Road, Springfield, VA, 22161, USA.
总页数：	u0814；30p
报告类型：	科技报告