详情

原文传递 Advanced Low-Cost Composite Curing With High Energy Electron Beams. Phase 2

题名：	Advanced Low-Cost Composite Curing With High Energy Electron Beams. Phase 2
作者：	Goodman, Daniel;
关键词：	FIBER REINFORCED COMPOSITES, ELECTRON BEAMS, CURING, LOW COSTS, HIGH ENERGY, GROUND VEHICLES, ADHESIVES, STRUCTURAL COMPONENTS.
摘要：	Electron Beam (EB) curing of resin and adhesive offers significant advantages for fabricating and bonding of fiber-reinforced polymer composites for ground vehicle structural components. The EB curing process reduces the time to cross-link the polymer matrix or the adhesive compared to conventional heat curing. The process allows curing at room temperature for high throughput and reduced residual stresses for good part fit-up. EB adhesive curing also prevents de-bonding of dissimilar materials that can occur during the cool-down cycle. As part of this SBIR, Science Research Laboratory (SRL) has developed resins, adhesives and electron gun technology for high-energy electron beam curing and bonding of composites. During Phase I, SRL developed B-stageable, EB-curable resins suitable for a high for the resin transfer molding I electron beam curing process. SRL also developed a costing model for this process and applied the model to one high-quantity part. During Phase II, SRL optimized and tested the novel resin system, and used the resins in production of EB-cured panels for the Army's Composite Armored Vehicle. SRL also developed novel EB-curable adhesives and demonstrated the advantages of EB curing of adhesives for automotive applications by bonding together test panels of the Chrysler Composite Concept Vehicle. Commercialization of EB curing in the automotive industry is continuing as part of SRL collaborations with Daimler-Chrysler and Ford. Because the properties of the B-stageable EB-curable resins were better than expected, and because of the processing advantages of B-staging, the aerospace community is also considering the use of these resins for aircraft parts. Resin and adhesive samples and associated design data have been requested by two groups at Boeing, and by designers at Lockheed Martin, Northrop Grumman and Raytheon/Hughes.
总页数：	41
报告类型：	科技报告