详情

原文传递 Assessment of microelectronics packaging for high temperature, high reliability applications

题名：	Assessment of microelectronics packaging for high temperature, high reliability applications
作者：	Uribe, F.;
关键词：	33 ADVANCED PROPULSION SYSTEMS ;42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES;99 MATHEMATICS, COMPUTERS, INFORMATION SCIENCE, MANAGEMENT, LAW, MISCELLANEOUS; COMPUTERIZED CONTROL SYSTEMS; MICROELECTRONICS; THERMAL ANALYSIS; AUTOMOBILES; INTERNAL COMBUSTION ENGINES; RELIABILITY; TEMPERATURE DEPENDENCE
摘要：	This report details characterization and development activities in electronic packaging for high temperature applications. This project was conducted through a Department of Energy sponsored Cooperative Research and Development Agreement between Sandia National Laboratories and General Motors. Even though the target application of this collaborative effort is an automotive electronic throttle control system which would be located in the engine compartment, results of this work are directly applicable to Sandia`s national security mission. The component count associated with the throttle control dictates the use of high density packaging not offered by conventional surface mount. An enabling packaging technology was selected and thermal models defined which characterized the thermal and mechanical response of the throttle control module. These models were used to optimize thick film multichip module design, characterize the thermal signatures of the electronic components inside the module, and to determine the temperature field and resulting thermal stresses under conditions that may be encountered during the operational life of the throttle control module. Because the need to use unpackaged devices limits the level of testing that can be performed either at the wafer level or as individual dice, an approach to assure a high level of reliability of the unpackaged components was formulated. Component assembly and interconnect technologies were also evaluated and characterized for high temperature applications. Electrical, mechanical and chemical characterizations of enabling die and component attach technologies were performed. Additionally, studies were conducted to assess the performance and reliability of gold and aluminum wire bonding to thick film conductor inks. Kinetic models were developed and validated to estimate wire bond reliability.
总页数：	403p
报告类型：	科技报告