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原文传递 MEMS: Micro Electro-Mechanical Systems for Wirelessly Monitoring the Health of Transportation Related Structures.

题名：	MEMS: Micro Electro-Mechanical Systems for Wirelessly Monitoring the Health of Transportation Related Structures.
关键词：	Blasting; Bridges; Construction; Crack Propagation; Inspections; Microelectromechanistic Systems; Monitoring; Structural Analysis; Transportation Engineering; Vibration; Wireless Sensor Networks
摘要：	This report on Micro Electro-Mechanical Systems (MEMS) describes the development of small, wireless systems to monitor the response of cracks for structural health monitoring on and near transportation related structures. Developed were two types of wireless structural health monitoring (SHM) systems to record characteristics of cracks over long periods of time: Autonomous Crack Monitoring (ACM) and Autonomous Crack Propagation Sensing (ACPS). ACM seeks to correlate changes in widths of cosmetic cracks in structures to nearby blasting or construction vibration activity for the purposes of litigation or regulation. ACPS seeks to track growth of cracks in steel bridges, supplementing regular inspections and alerting stakeholders if a crack has grown. The ever decreasing size and increasing performance of computer technology suggest that expensive, labor-intensive, and intrusive wired SHM systems may be replaced by a similarly capable, easier to install, yet less expensive and intrusive wireless SHM systems based on existing, commercially available wireless sensor networks. The implementation of a wireless SHM system with all the functions of a standard, wired, AC powered system, no requirement for an on-site personal computer for system operation, a small enough footprint such that it will not disturb residents of the instrumented structure, or interfere with the operation of a transportation related structure, a sensor suite that can be operated with minimal power use, and system operation for at least six months without a battery change or any other human intervention, is fraught with obvious and non-obvious challenges.
报告类型：	科技报告