原文传递 Post-Buckling Analysis of Curved Honeycomb Sandwich Panels Containing Interfacial Disbonds.
题名: Post-Buckling Analysis of Curved Honeycomb Sandwich Panels Containing Interfacial Disbonds.
作者: Pineda, E. J.; Bednarcyk, B. A.; Krivanek, T. K.
关键词: Buckling, Numerical analysis, Loads (forces), Grid refinement (mathematics), Fairings, Curved panels, Honeycomb cores, Sandwich structures, Honeycomb structures, Damage, Skin (structural member), Debonding (materials), Stiffness, Aluminum alloys, Carbon fibers, Fiber composites, Finite element method, Nonlinearity, Predictions, Spacecraft launching
摘要: A numerical study on the effect of facesheet-core disbonds on the post-buckling response of curved honeycomb sandwich panels is presented herein. This work was conducted as part of the development of a damage tolerance plan for the next-generation Space Launch System heavy lift launch vehicle payload fairing. As such, the study utilized full-scale fairing barrel segments as the structure of interest. The panels were composed of carbon fiber reinforced polymer facesheets and aluminum honeycomb core. The panels were analyzed numerically using the finite element method incorporating geometric nonlinearity. In a predetermined circular region, facesheet and core nodes were detached to simulate a disbond, between the outer mold line facesheet and honeycomb core, induced via low-speed impact. Surface-to-surface contact in the disbonded region was invoked to prevent interpenetration of the facesheet and core elements and obtain realistic stresses in the core. The diameter of this disbonded region was varied and the effect of the size of the disbond on the post-buckling response was observed. Significant changes in the slope of the edge load-deflection response were used to determine the onset of global buckling and corresponding buckling load. Finally, several studies were conducted to determine the sensitivity of the numerical predictions to refinement in the finite element mesh.
总页数: Pineda, E. J.; Bednarcyk, B. A.; Krivanek, T. K.
报告类型: 科技报告
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