题名: | Unified In Vivo/Ex Vivo Sensing Architectures for Monitoring Osseointegrated Prosthetics. |
作者: | Lynch, J. P.; Wang, W.; Sun, P.; Burton, A. |
关键词: | Prosthetics, Monitoring, Thin films, Additive manufacturing, Lithography, Substrates, Strain (mechanics), Piezoelectric transducers, Bone fractures, Fabrication, Waveforms, Polyethylene, Oi (osseointegrated), Oi prosthetics, Guided wave theory, Healing, Numerical simulation, Tof (time-of-flight), Tof analysis, Hdpe (high density polyethylene) |
摘要: | Osseointegrated prostheses have the potential to dramatically improve the quality of life of warfighters who suffer the loss of a limb. A unified in vivo/ex vivo sensing architecture is proposed for monitoring osseointegrated prostheses. First, biocompatible thin film sensors are proposed for in vivo placement in the host limb to monitor the mechanical behavior of the osseointegrated prosthesis and the in vivo conditions of the host tissue. Additive thin film manufacturing of lithographically patterned materials on biocompatible thin film substrates is proposed to create an array of sensing transducers including those capable of measuring strain. Inductive wireless interfaces are integrated in the thin film sensors to provide a means of powering and reading sensor outputs from outside the limb. Second, the adoption of ex vivo sensors that can be attached to the percutaneous extension of the osseointegrated prosthesis is explored. Piezoelectric transducers are proposed to introduce body waves into the prosthesis to assess its condition and integration with the host bone. The study uses numerical and experimental validation methods. |
报告类型: | 科技报告 |