原文传递 Analysis of the Axial Gap VS Fiberboard Moisture Content in a 9975 Shipping Package
题名: Analysis of the Axial Gap VS Fiberboard Moisture Content in a 9975 Shipping Package
作者: Daugherty, W. L.
关键词: Fiberboards##Moisture content##Shipping containers##Axial gap##Chlorides##Compaction##Corrosion##Dimensions##Heat##Layers##Packaging##Saturation##Surveys##
摘要: The fiberboard assembly within a 9975 shipping package contains a modest amount of moisture, which can migrate to the cooler regions of the package when an internal heat load is present. Typically, this leads to increased moisture levels in the bottom fiberboard layers, along with elevated chloride levels which can leach from the fiberboard. Concerns have been raised that this condition could lead to corrosion of the stainless steel drum. It has been postulated that checking the axial gap at the top of the package against the current 1 inch maximum criterion provides a sufficient indication regarding the integrity of the fiberboard and drum. This report estimates the increase in axial gap that might be expected for a given moisture increase in the bottom fiberboard layers, and the likelihood that the increase will create a nonconforming condition that will lead to identification of the moisture increase. Using data relating the fiberboard moisture content with the degree of compaction under load, the present analysis indicates that the axial gap will increase by 0.282 inch as the bottom fiberboard layers approach the saturation point. This increase will cause approximately 58% of packages with otherwise nominal package component dimensions to fail the axial gap criterion, based on a survey of axial gap values recorded in K-Area surveillance activities. As the moisture content increases above saturation, the predicted increase in axial gap jumps to 0.405 inch, which would result in 92% or more of all packages failing the axial gap criterion. The data and analysis described in this report are specific to cane fiberboard. While it is expected that softwood fiberboard will behave similarly, such behavior has not yet been demonstrated.
总页数: 19
报告类型: 科技报告
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