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原文传递 FULL-SCALE FIELD TEST OF UPLIFT RESISTANCE OF CORRUGATED METAL PIPE CULVERT.

题名：	FULL-SCALE FIELD TEST OF UPLIFT RESISTANCE OF CORRUGATED METAL PIPE CULVERT.
作者：	Kjartanson-BH; Lohnes-RA; Klaiber-FW; McCurnin-BT
关键词：	CORRUGATED-METAL-PIPES; PIPE-CULVERTS; FULL-SCALE-TESTS; FIELD-TESTS; UPLIFT-; FORCES-; FAILURES-; TIEDOWNS-; DESIGN-STANDARDS; DIAMETERS-; INLETS-; SOIL-STRUCTURE-INTERACTION; DEFLECTION-; STRAINS-; BACKFILLS-; EARTH-PRESSURES; MONITORING-; LOADING-TESTS; LONGITUDINAL-STIFFNESS
摘要：	Recent surveys of transportation agencies regarding corrugated metal pipe (CMP) culverts have indicated cases of longitudinal flexural failure due to uplift at the inlet. The surveys indicate that inlet tiedown design standards vary by more than 500% in the calculated tiedown force required for similar large diameter CMPs. In response to these problems, Iowa State University (ISU) is carrying out a multiphase research project to develop a rational design methodology for CMP inlet tiedowns. As a part of the ISU project, a full-scale field test involving a 16-m long and 3.05-m diameter CMP installed in a simulated highway embankment was conducted to gain insight into the soil-structure interaction processes and to obtain data for use in the development and verification of a CMP tiedown design methodology. Uplift forces were applied at the "inlet" end of the CMP by a system of hydraulic jacks mounted on a reaction frame. CMP deflections, strains, and backfill earth pressures were monitored as the CMP was incrementally loaded to give a maximum inlet uplift of about 76 mm. The test data indicate that the backfilled CMP subjected to inlet uplift forces behaves essentially as a cantilever beam, with the greatest bending occurring near the crest of the embankment slope. Analyses indicate that the backfill soil cover significantly increases the effective longitudinal stiffness of the CMP through soil-structure interaction processes and thus must be taken into account in a CMP inlet tiedown design.
总页数：	Transportation Research Record. 1995. (1514) pp74-82 (2 Phot., 10 Fig., 5 Ref.)
报告类型：	科技报告