原文传递
RT 184: Electronic Survivability in Harsh Environments.
| 题名： | RT 184: Electronic Survivability in Harsh Environments. |
| 作者： | Lall, P. |
| 关键词： | Failure mode and effect analysis, X-ray computed tomography, Delamination, Mechanics, X rays, Toughness, Systems engineering, Shelf life, Fe(finite element), Strain energy release |
| 摘要： | Determination of the fracture parameters such as fracture toughness and strain energy release rate under out-of-plane deformation. Effect of process parameters such as cure schedule and temperature on fracture toughness and characterize the mechanics of interface delamination of potting-PCB interface. Create modeling framework for delamination prediction. |
| 报告类型： | 科技报告 |
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