原文传递
Reliability of Silver Wire Bonds in Harsh Environments (RT 190).
| 题名： | Reliability of Silver Wire Bonds in Harsh Environments (RT 190). |
| 作者： | Lall, P. |
| 关键词： | Failure mode and effect analysis, Shear strength, High temperature, Cracks, Crack propagation, Systems engineering, Shear failure modes |
| 摘要： | Reliability of different wirebond material candidates subjected to HTSL. Identify modes of failures, reasons of failures and time to failure for each wirebond pair subjected to prolonged exposure at high temperature. IMC phase evolution sequence and cracking phenomenon in wirebonds. Relation between degradation of shear force with change in electric response. |
| 报告类型： | 科技报告 |
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