原文传递
Automotive ezcellence achieved by the first 100％ solder-free high power IGBT module
| 题名： | Automotive ezcellence achieved by the first 100％ solder-free high power IGBT module |
| 正文语种： | 中文 |
| 作者： | Norbert Pluschke |
| 作者单位： | Semikron (HongKong) o.,Ldt |
| 关键词： | contact technology IGBT SKiiP-Technology |
| 摘要： | A new high power IGBT module optimized for the requirements of automotive applicationswill be introduced. It is the first 100％ solder free isolated IGBT module in the market.The pressure contact technology was introduced by 5emikron in 1992. At that timeSemikron introduced an IGBT module without base plate. (SKiiP-Technology) No solderprocess between the DCB and base plate was necessary. The contact of the power andauxiliary terminals to the DC8 was not soldered. A new pressure system replaced theconventional solder system. Good reliability and low thermal impedance was the result.15 years later Semikron will introduce a base plate less IGBT module without any solderprocess. Actually the IGBT chip is soldered to the DCB but in the new IGBT module newsinter technology is used to connect the 1GBT chip to the DCB. |
| 会议日期： | 20080519 |
| 会议举办地点： | 上海 |
| 会议名称： | 第四届中国国际汽车电子产品与技术展览会暨国际汽车电子行业高层论坛 |
| 出版日期： | 2008-05-19 |
| 母体文献： | 第四届中国国际汽车电子产品与技术展览会暨国际汽车电子行业高层论坛论文集 |
| 分类号： | U463.6 |
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